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The heat dissipation substrate is a key heat dissipation component.

Heat dissipation substrate is an important component for heat dissipation, which is widely used in electronic equipment, automobile, aerospace and other fields. Its function is to increase the surface area and improve the heat conduction and radiation efficiency to maintain the normal operating temperature of the equipment and ensure its performance and life.

The heat dissipation substrate is usually made of a metal material, most commonly an aluminum substrate and a copper substrate. The aluminum substrate has the advantages of light weight, good thermal conductivity, and low cost, and is suitable for general heat dissipation requirements; while the copper substrate has the characteristics of better thermal conductivity, and is suitable for occasions that require higher heat dissipation performance.

The design of the heat dissipation substrate usually adopts a sheet-like or sheet-like arrangement, and the surface usually has fins or uneven structures to increase the surface area. The structure design is directly related to the heat dissipation effect. Generally speaking, the more fins, the larger the surface area, and the better the heat dissipation effect. At the same time, the spacing between the fins also needs to be reasonably designed. If it is too small, it will affect the air flow, and if it is too large, it will affect the heat dissipation effect.

The working principle of the heat dissipation substrate is to use heat conduction and heat radiation to dissipate heat. Heat conduction refers to the transfer of heat through the inside of the substance. The heat dissipation substrate quickly conducts the heat generated by the heat dissipation substrate to the heat dissipation substrate through direct contact with the heat generating source, and then transfers the heat to the air through the increased surface area of the fin. Thermal radiation refers to the thermal radiation energy emitted from the surface of an object, and the heat dissipation substrate dissipates heat to the surrounding environment through the radiation effect of its surface.

In practical applications, the heat dissipation substrate is usually used in cooperation with a heat dissipation fan or a heat sink to increase the heat dissipation effect. The heat dissipation fan improves the heat dissipation efficiency by generating an air flow to make the air flow through the fin gaps of the heat dissipation substrate. The heat sink further improves the heat dissipation effect by increasing the number and surface area of the heat dissipation substrates.

In addition to metal heat dissipation substrates, there are some new materials of heat dissipation substrates have also begun to be gradually applied to the field of heat dissipation, such as ceramic substrates, composite substrates, etc. These materials have the advantages of better thermal conductivity, lighter weight, corrosion resistance, etc., but due to cost and other factors, the current application is relatively small.

In short, the heat dissipation substrate is a key heat dissipation component. By increasing the surface area and improving the heat conduction and radiation efficiency, the operating temperature of the device can be effectively reduced to ensure its normal operation. With the continuous improvement of heat dissipation requirements in electronic equipment and other fields, the design and materials of the heat dissipation substrate are also continuously innovated and developed to meet the needs of different application scenarios.