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The design of the heat dissipation substrate is usually arranged in a sheet-like or sheet-like manner.

The heat-dissipating substrate is designed to improve the heat dissipation effect, so that heat can be more quickly transferred from the heat sink to the surrounding air. Common heat dissipation substrates are designed in two ways: sheet-like and sheet-like arrangement.

The sheet-shaped heat dissipation substrate is designed to have a surface of the heat sink in a shape of one piece, similar to a sheet, so that the heat dissipation surface area can be increased and the heat dissipation effect can be improved. The sheet-shaped heat-dissipating substrate may adopt various shapes and structures, such as a straight shape, a wave shape, etc., to increase heat conduction and heat transfer efficiency. The sheet-shaped heat-dissipating substrate is relatively simple to manufacture and low in cost, and is widely used in various heat-dissipating devices.

The sheet-like arrangement of the heat-dissipating substrate means that the heat-dissipating substrate is arranged on the surface of the heat sink according to a certain rule to form a whole. The sheet-like arrangement of the heat-dissipating substrates can be arranged in different ways, such as parallel arrangement, staggered arrangement, etc., to increase the heat-dissipating area and the heat conduction efficiency. This design method is usually applied to high-performance heat dissipation equipment, such as computer CPU radiators, automobile radiators, etc., to better dissipate heat and ensure the stable operation of the equipment.

The design of the heat dissipation substrate also needs to consider other factors, such as the selection of materials, the rationality of the structure, etc. The heat-dissipating substrate is usually made of a good heat-conducting material, such as copper, aluminum, etc., to improve the heat conduction effect. At the same time, the structure of the heat dissipation substrate also needs to be reasonably designed, so that heat can be evenly distributed and conducted, and hot spot accumulation and uneven heat dissipation can be avoided.

In general, the design of the heat dissipation substrate usually adopts a sheet-like or sheet-like arrangement to increase the heat dissipation area and improve the heat conduction effect. Different heat dissipation devices can choose different heat dissipation substrate design methods according to needs to achieve the best heat dissipation effect.