News

Gold heat dissipation material is a material with high thermal conductivity and low thermal resistance.

Alloy heat dissipation material is a kind of material that can effectively improve the heat dissipation performance. In the field of modern electronic technology, due to the high integration and high power density of electronic equipment, the generated heat often causes the equipment to overheat, affecting the performance and life of the equipment. Alloy heat dissipation materials can effectively conduct heat from electronic devices and quickly dissipate it to the surrounding environment through their good thermal conductivity and thermal diffusion properties, thereby maintaining a stable operating temperature of the device.

The main characteristics of alloy heat dissipation materials are high thermal conductivity and low thermal resistance. The alloy material is mixed with some thermal conductive elements, such as copper, aluminum, silver, etc., to improve the thermal conductivity of the material. At the same time, the grain size of the alloy material is relatively small, which is conducive to the diffusion and conduction of heat. In addition, the alloy heat dissipation material also has a lower thermal resistance, so that the heat can be transferred from the heat source to the surface of the material more quickly, and finally be dissipated into the air.

Alloy heat dissipation materials play an important role in the heat dissipation of electronic devices. First, the alloy material can be made in various shapes and sizes to accommodate different heat sinks and space constraints. Secondly, the high thermal conductivity of the alloy material can effectively conduct heat from the heat source to the heat dissipation device, and improve the heat dissipation efficiency. In addition, due to the low thermal resistance of the alloy material, the temperature rise of the heat dissipation device can be reduced, and the reliability and life of the heat dissipation device can be improved.

The preparation methods of alloy heat dissipation materials mainly include melting, casting, powder metallurgy, accumulation welding and so on. Among them, the smelting method is one of the most commonly used preparation methods. Alloy materials with good thermal conductivity are obtained by heating and melting different proportions of alloy elements, mixing and homogenizing, and then cooling and solidifying. The casting method is to inject the molten alloy material into the mold, and obtain the heat dissipation material of the required shape after cooling and solidification.

However, alloy heat sink materials also present some problems and challenges. First of all, the preparation cost of alloy materials is high, especially for some high-performance heat dissipation materials, the raw materials and processing costs are high. Secondly, the thermal expansion coefficient of the alloy material is large, and when it does not match the thermal expansion coefficient of other materials, it may cause thermal stress and stress cracks of the material, which affects the stability and life of the material.

In summary, the alloy heat dissipation material is a material with high thermal conductivity and low thermal resistance, which can effectively improve the heat dissipation performance of the electronic device. However, the preparation cost of the alloy heat dissipation material is high, and the matching of the thermal expansion coefficient of the material needs to be paid attention. In the future development, it is necessary to further improve the preparation process and performance of alloy heat dissipation materials to meet the needs of the continuous development of electronic equipment for heat dissipation materials.