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IGBT Pin Heat Dissipation Substrate
According to the needs of users, we have developed a variety of SiCp/Al, diamond, aluminum diamond, copper diamond, molybdenum, molybdenum copper, tungsten copper, copper molybdenum copper, copper-molybdenum copper-copper, Kovar, and other products to provide professional thermal management materials and technical solutions for manufacturers of microwave devices, high-power devices and microelectronic devices.
Material: Aluminum-based Silicon Carbide Hole position: can be freely designed Size: can be customized according to the requirements of freedom It is mainly used in EV/HEV IGBT packaging, such as new energy vehicles, hybrid vehicles, etc.
Classification:
Keywords: aluminum diamond, copper diamond, molybdenum sheet
online messageIGBT Pin Heat Dissipation Substrate
| Materials | Dimensions | Hole position | Welding surface | Non-welding surface | needle shape | Plating | Solder mask |
| aluminum-based silicon carbide | Can be customized according to the requirements of freedom | Can be designed freely | Plane | Needle row face | Can be freely designed according to demand | Bright nickel, matty nickel, nickel boom, etc. | Selectable |
It is mainly used in EV/HEV IGBT packaging, such as new energy vehicles, hybrid vehicles, etc.
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