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Copper diamond
According to the needs of users, we have developed a variety of SiCp/Al, diamond, aluminum diamond, copper diamond, molybdenum, molybdenum copper, tungsten copper, copper molybdenum copper, copper-molybdenum copper-copper, Kovar, and other products to provide professional thermal management materials and technical solutions for manufacturers of microwave devices, high-power devices and microelectronic devices.
Metal-based diamond composites, by adding diamond particles with high thermal conductivity and low thermal expansion coefficient into Al, Cu or Ag matrix with good thermal conductivity, thus integrating excellent composite properties with high thermal conductivity and adjustable thermal expansion coefficient, are considered to be the most promising new thermal management materials. This high-performance metal matrix composite heat dissipation material is mainly used in high-tech technology devices such as: high-power insulated gate bipolar transistor (IGBT), microwave, electromagnetic, optoelectronic and other devices, as well as phased array radar, high-energy solid-state lasers and other typical applications in the field of national defense technology.
Classification:
Keywords: aluminum diamond, copper diamond, molybdenum sheet
online messageCopper diamond
Metal-based diamond composites, by adding diamond particles with high thermal conductivity and low thermal expansion coefficient into Al, Cu or Ag matrix with good thermal conductivity, thus integrating excellent composite properties with high thermal conductivity and adjustable thermal expansion coefficient, are considered to be the most promising new thermal management materials. This high-performance metal matrix composite heat dissipation material is mainly used in high-tech technology devices such as: high-power insulated gate bipolar transistor (IGBT), microwave, electromagnetic, optoelectronic and other devices, as well as phased array radar, high-energy solid-state lasers and other typical applications in the field of national defense technology.
Properties of metal matrix diamond composites
|
Materials |
Thermal conductivity at room temperature (R · T) [W/(m · k)] |
Coefficient of thermal expansion (R · T ~ 400 ℃) [ppm/k] |
Bending strength [MPa] |
Density [g/cm3] |
|
Al-Diamond |
≥ 500 |
7~10.5 |
≥ 350 |
3~3.3 |
|
With-Diamond |
≥ 700 |
6~8.5 |
≥ 450 |
5~5.5 |
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