Products & Service
Diamond
According to the needs of users, we have developed a variety of SiCp/Al, diamond, aluminum diamond, copper diamond, molybdenum, molybdenum copper, tungsten copper, copper molybdenum copper, copper-molybdenum copper-copper, Kovar, and other products to provide professional thermal management materials and technical solutions for manufacturers of microwave devices, high-power devices and microelectronic devices.
The thermal conductivity of diamond is the best known material in nature, and good insulation performance, making diamond an ideal electronic heat sink material, used in the production of high-power semiconductor devices, microwave devices and large-scale integrated circuit heat sink. We can carry out single-sided, double-sided lapping, polishing and other processing.
Classification:
Keywords: aluminum diamond, copper diamond, molybdenum sheet
online messageDiamond
The thermal conductivity of diamond is the best known material in nature, and good insulation performance, making diamond an ideal electronic heat sink material, used in the production of high-power semiconductor devices, microwave devices and large-scale integrated circuit heat sink. We can carry out single-sided, double-sided lapping, polishing and other processing.
Diamond |
silicon carbide volume fraction55~70% |
Vickers hardnesskg/mm2 |
8000-10000 |
Thermal conductivity((W/mK)@25℃) |
1000-2000 |
Density(g/cm³) |
3.51 |
LineCoefficient of thermal expansion(CTE ppm/。) |
2.3 |
Resistivity |
>1010Ωcm(Bottom polished) |
>106Ωcm(growth surface) |
|
Cutting tolerance |
≤0.03mm |
Roughness |
≤0.03µm |
Blank thickness |
0.30-2.5mm |
Previous Page
Next Page
Previous Page
Copper diamond
Next Page