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Thermal Substrates

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IGBT Pin Heat Dissipation Substrate

IGBT Pin Heat Dissipation Substrate

Material: Aluminum-based Silicon Carbide Hole position: can be freely designed Size: can be customized according to the requirements of freedom It is mainly used in EV/HEV IGBT packaging, such as new energy vehicles, hybrid vehicles, etc.

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Thermal Substrates

AlSiC planar substrate

AlSiC planar substrate

Material: Aluminum-based Silicon Carbide Size: can be customized according to the requirements of freedom Hole position: can be freely designed It is mainly used in the packaging of high-power IGBT modules, such as motor cars, electric locomotives, monorail trains, subways, etc.

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Thermal Substrates

Double-sided heat sink (Spacer)

Double-sided heat sink (Spacer)

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Thermal Substrates